Director of Hardware Engineering (AI Infrastructure Systems)

Join Axelera, a leading AI hardware company, as the Director of Hardware Engineering for our AI Enterprise Division. In this hands-on role, you will build and lead a multidisciplinary engineering team, define the technical roadmap for our server products, and drive end-to-end execution from concept to mass production. You will also engage directly with strategic customers and partners, ensuring compliance with enterprise and datacenter standards. This is an exciting opportunity to shape the future of AI infrastructure systems.

• Construire et diriger une équipe d'ingénierie pour le développement de produits matériels de classe datacenter.
• Définir la feuille de route technique pour les produits de serveur de niveau carte et système, alignée sur la feuille de route du silicium de prochaine génération.
• Assurer l'exécution de bout en bout depuis le concept jusqu'à la production de masse, y compris la qualification de fiabilité.
• We are looking for an entrepreneurial, technically exceptional engineering leader to establish and run Axelera’s AI Enterprise Division within the AI Integrated Systems (AIS) group
• Proven track record of shipping datacenter- or server-class compute hardware into volume production: accelerator cards, GPU/xPU-class modules, server motherboards, compute nodes or rack-level systems
• Deep expertise in high-speed interfaces (PCIe Gen4/5/6, CXL, high-speed SerDes), enterprise memory, high-current power delivery and VRM design, and high-density PCB layout with rigorous SI/PI methodology
• Hands-on ability to review schematics, layouts, simulation results and lab validation dat, and to make the call when the team is stuck
• Familiarity with datacenter and enterprise compliance (EN 55032/35 Class A, UL 62368, EN 50600, NEBS where relevant) and with OCP standards and contribution/consumption processes
• 15+ years in hardware engineering for complex electronics products, with at least 5 years in senior leadership roles running multidisciplinary teams
• Strong strategic thinker, excellent communicator, skilled at decision-making in fast-moving environments, comfortable engaging at C-level with customers and partners
• Experience working with tier-1 CMs/ODMs on server-class products, including DFM, MP transfer, yield ramp and sustaining engineering
• Experience with BMC-based platform management,Redfish/IPMI, UEFI/BIOS or equivalent firmware stacks, secure boot/root-of-trust, and enterprise RAS features
• Working knowledge of datacenter thermal and mechanical design: air-cooled 1U/2U chassis , direct liquid cooling and/or immersion-ready platforms, and rack power delivery at 12V, 48V and OCP power-shelf level
• Experience building or significantly scaling an engineering team is strongly preferred
• Experience with AI accelerator platforms, GPUs or custom silicon in a datacenter context is a strong plus
• Fluent English required; additional European language is a plus
• Exposure to sovereign AI, EuroHPC, HPC or European defence/dual-use datacenter programmes is a plus