Head of Platform Mechanical & Thermal Engineering

Join our Platform Team as the Head of Platform Mechanical & Thermal Engineering. In this leadership role, you will oversee all aspects of mechanical architecture, advanced cooling, and CAD infrastructure for next-generation high-power density ASIC systems. You will build and scale the mechanical and thermal engineering organization, focusing on liquid cooling technologies and rack-level thermal management. Your responsibilities will include designing server enclosures, driving liquid cooling solutions, deploying and optimizing CAD/PLM workflows, establishing simulation infrastructure, defining test plans, overseeing lab infrastructure, collaborating with various engineering teams, engaging with suppliers and partners, and representing mechanical and thermal engineering in executive reviews.

• Lead all aspects of mechanical architecture, advanced cooling, and CAD infrastructure for next-generation high-power density ASIC systems.
• Build, mentor, and scale a team of mechanical and thermal engineers, defining hiring plans and technical standards for advanced cooling and mechanical design.
• Establish and scale simulation infrastructure, including Flowtherm and Ansys Icepak for detailed CFD of component and system thermal behavior.
• Strong record of bringing complex server or datacenter platforms from concept through production
• Bachelor’s or Master’s in Mechanical Engineering, Thermal Engineering, or related field
• Hands-on experience with Flowtherm, Ansys Icepak, and MacroFlow for CFD and rack-level thermal modeling
• Proven expertise in liquid cooling architectures for high-power density ASICs or GPUs
• 10+ years of experience in mechanical and thermal engineering for high-performance computing systems, with at least 5+ years in leadership roles
• Deep understanding of thermal validation, fluid integrity testing, and mechanical reliability for liquid-cooled systems
• Proficiency with Siemens NX for 3D CAD; experience scaling CAD/PLM environments across teams