Senior IC Substrate Package Layout Designer

We are looking for an experienced Senior IC Substrate Package Layout Designer to lead advanced semiconductor package development from die netlist analysis, bump feasibility and package planning through substrate layout, SI/PI optimization, and manufacturing release. The role requires close collaboration with Backend/Physical Design, SI/PI, Assembly, Reliability, and Manufacturing teams to deliver high-performance package solutions for complex SoCs and multi-die products. You will focus on: - Own complete package design activities including die bump planning, pin...