封装开发专家-Packaging Development Expert(J17586)

1.Responsible for Dram bumping ,RDL , FO and the other new product development and project management.

1. Analyze and solve technical problems in the development, optimize the process flow and reduce costs.

• 3.Manage bumping roadmap, RDL roadmap and strategy and execute promotion
• 4.Improve PKG development efficiency and co-work with package relevant department.

1. Bumping OSAT project management and Process integration
2. Responsible for the assessment and introduction of bumping materials
3. Continue to pay attention to and research advanced bumping and RDL process technology
4. bachelor degree or above
5. More than 8 years of Bumping process development experience , Memory product related experience is preferred . Bumping PIE preferred .

• 3.proficient in the characteristics of Bumping materials
• 4.proficient in bumping process
• 5.proficient in bumping design rule