About The Role

Lead the RET solution path findings in advanced nodes of DRAM processes；
Maintain and develop new recipes to deliver robust post OPC solutions to the apeout team；
Engage with layout/device/integration teams on the DFM/DTCO flow delivery；
Trouble shooting with inline defects and provide possible RET/OPC supports；
Optimize the RET/OPC flow to improve the TAT and efficiency.
Master degree in Physical Sciences, Optics, Electrical Engineering, Chemical Engineering, Materials Science, Mathematics etc；
3 years+ experiences of OPC tools and lithography；
Strong analytical and problem solving skills；
Strong desire and ability to work on new topics to overcome future lithography challenges in the DRAM industry；
Ability to work both independently and in a team environment；
Fluent English speaking & writing skills；
Prefer candidate have background in mask data preparation, physical design, RET, OPC, lithography and other wafer processing steps.

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光学邻近效应修正工程师-OPC Engineer(J18813)