Applications Engineer

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.

Diamond Foundry is revolutionizing industries with single-crystal diamond, the ultimate material for advanced electronics and thermal management. As the world's leading producer of lab-grown diamond, we are expanding our application engineering team to support our growing customer base in the semiconductor industry. We seek a highly motivated and experienced Application Engineering Manager to drive the adoption of our cutting-edge diamond solutions in advanced packaging and thermal applications.

Responsibilities

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Drive Technical Solutions: Lead the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes.

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Provide Subject Matter Expertise: Serve as a technical expert on thermal management principles, material characterization, and high-performance diamond applications for both internal teams and external customers.

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Bridge R&D and Customers: Collaborate closely with R&D and Product Development teams to translate customer feedback into product improvements, identify new application opportunities, and inform future product roadmaps.

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Customer Integration & Support: Partner directly with semiconductor customers to understand their thermal challenges, guide product selection, and support integration from early-stage prototyping through qualified production.

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Cross-Functional Execution: Work alongside manufacturing, reliability, and sales teams to ensure successful technology transfers, compliance demonstration, and customer success.

Requirements

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Education & Experience: Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field, with 5+ years of hands-on experience in semiconductor packaging and/or thermal management applications.

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Technical Depth: Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques (including 2.5D/3D IC thermal solutions).

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Proven Execution: Demonstrated track record of hands-on development, integration, troubleshooting, and scaling concepts from R&D into mass production.

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Industry Knowledge: Strong familiarity with systems engineering, high thermal conductivity materials, reliability and compliance demonstration, and technology transfer processes within the semiconductor ecosystem.

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Communication & Ownership: Excellent communication, presentation, and interpersonal skills, with the ability to lead technical discussions, support business development, and work effectively across cross-functional teams.